Display substrate and display device

ABSTRACT

A display substrate includes a substrate, a first insulator, a metal film, a second insulator, an alignment film, a line, and film forming area defining recesses. The substrate includes a display area and a non-display area. The metal film is disposed in a layer upper than the first insulator. The second insulator is disposed upper than the metal film and has a thickness smaller than a thickness of the first insulator. The alignment film is disposed upper than the second insulator. The line extends to straddle the display area and the non-display area and includes a section of the metal film. The film forming area defining recesses in the non-display area to extend in a direction crossing an extending direction of the line but not to overlap the line include recessed sections of the first insulator to define a forming area of the alignment film.

TECHNICAL FIELD

The present invention relates to a display substrate and a display device.

BACKGROUND ART

A display device with a built-in touchscreen panel described in Patent Document 1 is known as an example. The display device with the built-in touchscreen panel includes a touchscreen panel that is built in a display panel through the in-cell technology. The display device with the built-in touchscreen panel described in Patent Document 1 includes a panel, a touch integrated circuit, a data driver, and a gate driver. The panel includes data lines extending in a first direction, gate lines extending in a second direction, and electrodes grouped into multiple groups. The touch integrated circuit is configured to apply touch drive signals to all or some of the electrodes when a drive mode is in a touch driver mode. The data driver is configured to apply data voltages to the data lines when the drive mode is in a display drive mode. The gate driver is configured to supply scan signals to the gate lines in sequence when the drive mode is in the display drive mode. When the drive mode is in the touch drive mode, the touch drive signals or signals corresponding to the touch driver signals are applied to all or some of the gate lines.

RELATED ART DOCUMENT

Patent Document

-   Patent Document 1: Japanese Unexamined Patent Application     Publication No. 2015-122057

Problem to be Solved by the Invention

In the display device with the built-in touch screen panel described in Patent Document 1, signal lines to which the touch drive signals related to touch detection are supplied are prepared from a metal film disposed in a layer that is upper than a first protective layer that is disposed in a layer that is upper than the data lines to which the data voltages related to image display are applied. In general, a liquid crystal display device including a liquid crystal, as in the display device with the built-in touchscreen panel, includes an alignment film for aligning orientation of liquid crystal molecules. The alignment film has high flowability during film formation and thus a groove for defining a film forming area may be formed in an insulator such as a first protective film. If such a groove is formed in the first protective layer described in Patent Document 1, flatness of the signal lines prepared from a metal film in a layer that is upper than the first protective layer may decrease resulting in broken lines.

DISCLOSURE OF THE PRESENT INVENTION

The present invention was made in view of the above circumstances. An object is to define a film forming area of an alignment film while flatness of lines is maintained.

Means for Solving the Problem

A display substrate according to the present invention includes a substrate, a first insulator, a metal film, a second insulator, an alignment film, a line, and film forming area defining recesses. The substrate includes a display area in which an image is displayed and a non-display area on an outer edge side to surround the display area. The first insulator is disposed to straddle the display area and the non-display area of the substrate. The metal film is disposed in a layer that is upper than the first insulator to straddle the display area and the non-display area of the substrate. The second insulator is disposed in a layer that is upper than the metal film to straddle the display area and the non-display area of the substrate. The second insulator has a thickness smaller than a thickness of the first insulator. The alignment film is disposed in a layer that is upper than the second insulator at least in the display area. The line extends to straddle the display area and the non-display area. The line includes a section of the metal film. The film forming area defining recess is provided in the non-display area to extend in a direction crossing an extending direction in which the line extends but not to overlap the line. The film forming area defining recesses include recessed sections of the first insulator to define a forming area of the alignment film.

In formation of the alignment film, a material of the alignment film having flowability is supplied to the display area of the substrate. The material flows and spread in the layer that is upper than the second insulator film on the substrate and the alignment film is formed at least in the display area. The material of the alignment film supplied to the display area may reach the non-display area. By defining the forming area of the alignment film with the film forming area defining recesses in the non-display area, the material of the alignment film is less likely to spread outer than the film forming area defining recesses in the non-display area.

The film forming area defining recesses extend in the direction crossing the extending direction in which the line extends. The film forming area defining recesses include the recessed sections of the first insulator having the thickness larger than the thickness of the second insulator. This configuration is preferable for obtaining a larger depth. A larger amount of the material of the alignment film can be held in each of the film forming area defining recesses thus the performance in definition of the film forming area to form the alignment film further improves. Although the first insulator including the film forming area defining recesses is disposed in the layer that is lower than the metal film, the film forming area defining recesses do not overlap the line. Therefore, the film forming area defining recesses are less likely to affect planarization of the line. According to the configuration, the line is less likely to have irregularities in thickness resulting from the film forming area defining recesses. Therefore, the line is less likely to have breaks.

Preferred embodiments of the display substrate according to the present invention may have following configurations.

(1) The film forming area defining recesses may be drilled through the first insulator. According to the configuration, the film forming area defining recesses are provided with a maximum depth. A further larger amount of the material of the alignment film can be held in the film forming area defining recesses and thus the performance in definition of the film forming area to form the alignment film further improves.

(2) The film forming area defining recesses may not be formed in two line adjacent sections of the first insulator sandwiching the line. The second insulator may include second film forming area defining recesses to overlap the line and the line adjacent sections. According to the configuration, the film forming area defining recesses are not formed in not only the section of the first insulator overlapping the line but also the line adjacent sections of the first insulator sandwiching at least the line. Even if the first insulator having the thickness larger than the thickness of the second insulator is processed with lower accuracy, the film forming area defining recesses are less likely to be accidentally formed to overlap the line. According to the configuration in which the film forming area defining recesses are not formed in the line adjacent sections, the performance in definition of the film forming area to form the alignment film decreases in the sections. With the second insulator includes the second film forming area defining recesses formed in the line and the line adjacent sections in which the film forming area defining recesses are not formed to overlap the line and the line adjacent sections, the forming area of the alignment film is defined by the second film forming area defining recesses. Therefore, the performance in in definition of the film forming area in which the alignment film is formed is less likely to decrease.

(3) The second insulator may include a lower second insulator disposed in a lower layer and an upper second insulator disposed in an upper layer. The display substrate may further include a first transparent electrode film, a second transparent electrode film, and position detection electrodes. The first transparent electrode film may be disposed between the lower second insulator and the upper second insulator. The second transparent electrode film may be disposed in a layer that is upper than the upper second insulator. The position detection electrodes may include sections of the first transparent electrode film or the second transparent electrode film. The position detection electrodes may form a capacitor with a position input member by which a position input is performed to detect a position of input by the position input member. The line may include a position detection line connected to the position detection electrodes. According to the configuration, the position detection electrodes form the capacitor with the position input member to perform the position input and the position of the input by the position input member can be detected using signals supplied through the position detection line. The position detection line, which is the line, is less likely to have breaks resulting from the film forming area defining recesses. Therefore, the position detection function is properly performed.

To solve the problem describe earlier, a display device according to the present invention includes the display substrate and an opposed substrate opposed to the display substrate with an internal space between the display substrate and the opposed substrate. In the display device having such a configuration, the line is less likely to have breaks resulting from the film forming area defining recesses. Therefore, a malfunction is less likely to occur.

Preferred embodiments of the display device according to the present invention may have following configurations.

(1) The display device may further include a sealant disposed between the display substrate and the opposed substrate in the non-display area to surround and seal the internal space. The film forming area defining recesses may be located at positions overlapping the sealant and closer to the internal space relative to an outer edge of the sealant. By defining the forming area of the alignment film with the film forming area defining recesses having such a configuration, the alignment film is less likely to reach at least the outer edge of the sealant. According to the configuration, a fixing strength of the sealant to the substrate is properly maintained and thus the substrates are less likely to be removed.

(2) The display device may further include a lower metal film and a lead. The lower metal film may be disposed in a layer that is lower than the first insulator. The lead may be disposed on an opposite side from the internal space relative to the sealant in the non-display area. The lead may include a section of the lower metal film and include a section overlapping the line. The first insulator may include a contact hole overlapping the line and the lead. According to the configuration, the line is connected to the lead including the section of the lower metal film via the contact hole in the first insulator. In comparison to a configuration in which the contact hole is located on an internal space side relative to the sealant, this configuration is preferable for improving definition and reducing the frame width because the lower metal film can be used for other lines in the internal space. A section of the metal film disposed in the layer that is upper than the first insulator may be configured as the line. Because the first insulator may include the film forming area defining recesses not to overlap the line, the forming area of the alignment film is properly defined without a reduction in flatness of the line.

Advantageous Effect of the Invention

According to the present invention, the forming area of the alignment film is defined with the flatness of the line maintained.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view schematically illustrating a liquid crystal panel according to a first embodiment of the present invention.

FIG. 2 is a plan view illustrating two-dimensional arrangement touch electrodes and touch lines in the liquid crystal panel included in a liquid crystal display device.

FIG. 3 is a plan view illustrating arrangement of pixels on an array substrate included in the liquid crystal panel.

FIG. 4 is a cross-sectional view along line A-A in FIG. 3.

FIG. 5 is a cross-sectional view illustrating a connection between the touch line and a touch lead line on the array substrate.

FIG. 6 is a plan view illustrating film forming area defining recesses and the touch lines disposed between a display area of the array substrate and a driver.

FIG. 7 is a cross-sectional view along line B-B in FIG. 6.

FIG. 8 is a cross-sectional view along line C-C in FIG. 6.

FIG. 9 is a cross-sectional view along line D-D in FIG. 6.

FIG. 10 is a plan view illustrating film forming area defining recesses and touch lines disposed between a display area of an array substrate and a driver according to a second embodiment of the present invention.

FIG. 11 is a cross-sectional view along line C-C in FIG. 10.

FIG. 12 is a cross-sectional view along line D-D in FIG. 10.

FIG. 13 is a cross-sectional view along line E-E in FIG. 10.

MODES FOR CARRYING OUT THE INVENTION First Embodiment

A first embodiment of the present invention will be described with reference to FIGS. 1 to 9. In this section, a liquid crystal panel 10 (a display device, a display device with a position input function) with a display function and a touch panel function (a position input function) will be described. X-axes, Y-axes, and Z-axes may be present in the drawings. The axes in each drawing correspond to the respective axes in other drawings. An upper side and a lower side in FIGS. 1, 4 and 7 to 9 correspond to a front side and a back side of the liquid crystal panel 10, respectively.

The liquid crystal panel 10 is configured to display images using illumination light supplied by a backlight unit (a lighting unit), which is not illustrated. As illustrated in FIG. 1, the liquid crystal panel 10 includes at least a pair of glass substrates 10 a and 10 b, a liquid crystal layer 10 c, and a sealant 10 d. The substrates 10 a and 10 b are substantially transparent and have high light transmissivity. The liquid crystal layer 10 c is in an internal space 101S between plate surfaces of the substrates 10 a and 10 b that are opposed to each other. The liquid crystal layer 10 c includes liquid crystal molecules that are substances having optical characteristics that vary according to application of electric fields. The sealant 10 d is disposed between the substrates 10 a and 10 b to surround the internal space 10S (the liquid crystal layer 10 c) and seal the internal space 101S and the liquid crystal layer 10 c. One of the substrates 10 a and 10 b included in the liquid crystal panel 10 on the front side is a CF substrate 10 a (an opposed substrate). The other one on the rear side (on the back side) is an array substrate 10 b (a display substrate, an active matrix substrate). The CF substrate 10 a and the array substrate 10 b are prepared by forming various films on top of one another on inner surfaces of glass substrates 10GS (substrates). The sealant 10 d is made of a light curing resin material such as an ultraviolet curing resin material. The sealant 10 d has a frame shape to extend along outer edges of the CF substrate 10 a (see FIG. 2). Polarizing plates are affixed to outer surfaces of the substrates 10 a and 10 b, respectively. In FIG. 2, a forming area of the sealant 10 d is indicated by a long dashed double-dotted line.

As illustrated in FIG. 2, an inner area of the liquid crystal panel 10 surrounded by the sealant 10 d is configured as a display area AA in which images are displayed (an area defined by a chain line in FIG. 2). An outer area in a frame shape surrounding the display area AA is configured as a non-display area NAA in which the images are not displayed. The array substrate 10 b included in the liquid crystal panel 10 is larger than the CF substrate 10 a. A portion of the array substrate 10 b project from a side of the CF substrate 10 a. In the projecting portion of the array substrate 10 b (the non-display area NAA), a driver 11 (a driver circuit) and a flexible circuit board 12 (a signal transmitting portion) which are components for supplying various signals related to the display function and the touch panel function are mounted. The driver 11 is an LSI chip including a driver circuit therein and mounted in the projecting portion (at a position closer to the display area AA relative to the flexible circuit board 12), which is the non-display area NAA of the array substrate 10 b, through the chip-on-glass (COG) technology. The driver 12 processes the various signals transmitted via the flexible circuit board 12. The flexible circuit board 12 includes a synthetic resin substrate (e.g., polyimide-based resin substrate) having insulating property and flexibility and multiple wirings (not illustrated) formed on the substrate. A first end of the flexible circuit board 12 is connected to the projecting portion of the array substrate 10 b (at an end of the projecting portion with the driver 11 sandwiched between the display area AA and the end) and a second end of the flexible circuit board 12 is connected to a control circuit board (a signal source), which is not illustrated. The signals from the control circuit board are transmitted to the liquid crystal panel 10 via the flexible circuit board 12, processed by the driver 11 in the non-display area NAA, and output to the display area AA.

As illustrated in FIG. 3, thin film transistors 10 f (TFTs, switching components) and pixel electrodes 10 g are arranged in a matrix along the X-axis direction and the Y-axis direction on an inner surface of the array substrate 10 b (on a liquid crystal layer 10 c side, on an opposed surface side opposed to the CF substrate 10 a) in the display area AA. Gate lines 10 i (scanning lines) and source lines 10 j (signal lines, data lines) are routed in a grid to surround the TFTs 10 f and the pixel electrodes 10 g. The gate lines 10 i extend in a direction substantially along the X-axis direction. The source lines 10 j extend in a direction substantially along the Y-axis direction. The source lines 10 j include diagonally extending sections 10 j 1 that extend in a diagonal direction relative to the X-axis direction and the Y-axis direction. The gate lines 10 i are connected to gate electrodes 10 f 1 of the TFTs 10 f. The source lines 10 j are connected to source electrodes 10 f 2 of the TFTs 10 f. The pixel electrodes 10 g are connected to drain electrodes 10 f 3 of the TFTs 10 f. The TFTs 10 f are driven based on various signals supplied to the gate lines 10 i and the source lines 10 j. Through the driving of the TFTs 10 f, application of voltages to the pixel electrodes 10 g is controlled. Each of the pixel electrodes 10 g has a vertically-long parallelogram shape in a plan view. The source lines 10 j are disposed between the pixel electrodes 10 g that are adjacent to each other in a short-side direction of the pixel electrodes 10 g (the X-axis direction). The gate lines 10 i are disposed between the pixel electrodes 10 g that are adjacent to each other in a long-side direction of the pixel electrodes 10 g (the Y-axis direction). The long sides of the pixel electrodes 10 g are parallel to the diagonally-extending sections 10 j 1 of the source lines 10 j.

As illustrated in FIGS. 3 and 4, a common electrode 10 h is disposed to overlap all pixel electrodes 10 g on an upper layer side relative to the pixel electrodes 10 g (closer to the liquid crystal layer 10 c) in the display area AA on the inner surface of the array substrate 10 b. The common electrode 10 h spreads over substantially an entire area of the display area AA to apply a reference voltage that is normally about constant. The common electrode 10 h includes pixel overlapping openings 10 hl (pixel overlapping slits, alignment control slits) formed in areas overlapping the corresponding pixel electrodes 10 g. The pixel overlapping openings 10 hl extend along the diagonally-extending sections 10 j 1 (in a longitudinal direction of the pixel electrodes 10 g). When potential differences are created between the pixel electrodes 10 g and the common electrode 10 h that overlap each other as the pixel electrodes 10 g are charged, fringe electric fields (oblique electric fields) are generated between opening edges of the pixel overlapping openings 10 hl and the pixel electrodes 10 g. The fringe electric fields include components parallel to the plate surface of the array substrate 10 b and components normal to the plate surface of the array substrate 10 b. With the fringe electric fields, orientations of the liquid crystal molecules included in the liquid crystal layer 10 c can be controlled. Namely, the liquid crystal panel 10 according to this embodiment operates in fringe field switching (FFS) mode.

As illustrated in FIG. 4, color filters 10 k that exhibit three different colors of red (R), green (G), and blue (B) are disposed on the inner surface side of the CF substrate 10 a in the display area AA. The color filters 10 k that exhibit different colors are repeatedly arranged along the gate lines 10 i (in the X-axis direction). The color filters 10 k extend along the source lines 10 j (substantially the Y-axis direction). Namely, the color filters 10 k are arranged in a stripe as a whole. The color filters 10 k are arranged to overlap the pixel electrodes 10 g on the array substrate 10 b in a plan view. The color filters 10 k that are adjacent to each other in the X-axis direction and exhibit different colors are arranged such that boundaries therebetween (color boundaries) overlap the source lines 10 j and a light blocking portion 101. In the liquid crystal panel 10, the R, the G, and the B color filters 10 k that are arranged along the X-axis direction and three pixel electrodes 10 g opposed to the respective color filters 10 k compose three colors of pixels PX. In the liquid crystal panel 10, the R, the G, and the B pixels PX that are adjacent to one another in the X-axis direction form a display pixel configured to perform color display in predefined tones. An interval of the pixels PX in the X-axis direction is several tens of μm.

As illustrated in FIGS. 3 and 4, the light blocking portion 101 (an inter-pixel light blocking portion, a black matrix) configured to block light is disposed on the inner surface side of the CF substrate 10 a in the display area AA. The light blocking portion 101 is formed in a grid pattern in a plan view to separate the adjacent pixels PX (the pixel electrodes 10 g). The light blocking portion 101 includes pixel openings 1011 at positions overlapping large areas of the pixel electrodes 10 g on the array substrate 10 b side in a plan view. The pixel openings 1011 are arranged in a matrix along the X-axis direction and the Y-axis direction within the plate surface of the CF substrate 10 a. Each pixel opening 1011 has a vertically-long parallelogram shape in the plan view along an outline of the pixel electrode 10 g. The pixel openings 1011 pass light therethrough for display at the pixels PX. The light blocking portion 101 restricts light from traveling between the adjacent pixels PX to ensure independency of tones of each pixel PX. Especially, sections of the light blocking portion 101 extending along the source lines 10 j reduce color mixture between the pixels PX that exhibit different colors. The light blocking portion 101 is disposed to overlap the gate lines 10 i and the source lines 10 j on the array substrate 10 b in a plan view.

As illustrated in FIG. 4, alignment films 10 m and 10 n are disposed on the innermost surfaces of the substrates 10 a and 10 b that contact the liquid crystal layer 10 c, respectively. The alignment films 10 m and 10 n are for aligning the orientation of the liquid crystal molecules in the liquid crystal layer 10 c. The alignment films 10 m and 10 n may be made of polyimide. The alignment films 10 m and 10 n are formed in solid patterns in at least about entire display areas AA of the substrates 10 a and 10 b. The alignment films 10 m and 10 n are photo-alignment films that are capable of aligning the orientation of the liquid crystal molecules along a travelling direction of rays of light in a specific wavelength region (e.g., ultraviolet rays) when irradiated with the rays of light. A planarization film may be disposed between the alignment film 10 m and the color filters 10 k on the CF substrate 10 a.

The liquid crystal panel 10 according to this embodiment has a display function for displaying images and a touch panel function (a position input function) for detecting positions of input by a user based on displayed images (input positions). The liquid crystal panel 10 includes an integrated touch panel pattern (with an in-cell technology) for exerting the touch panel function. The touch panel pattern uses a projection type electrostatic capacitance method and performs detection using a self-capacitance method. As illustrated in FIG. 2, the touch panel pattern includes touch electrodes 14 (position detection electrodes) disposed on the array substrate 10 b of the substrates 10 a and 10 b and arranged in a matrix within the plate surface of the array substrate 10 b. The touch electrodes 14 are disposed in the display area AA of the array substrate 10 b. The display area AA of the liquid crystal panel 10 substantially corresponds with a touch area in which input positions are detectable (a position input area). The non-display area NAA substantially corresponds with a non-touch area in which input positions are not detectable (a non-position input area). When the user intends to input a position based on a displayed image in the display area AA of the liquid crystal panel 10 recognized by the user and brings his or her finger (a position input body), which is a conductive member but not illustrated, closer to the surface of the liquid crystal panel 10 (a display surface), the finger and the touch electrode 14 form a capacitor. A capacitance measured at the touch electrode 14 close to the finger changes as the finger approaches to the touch electrode 14. The capacitance at the touch electrode 14 is different from the capacitance at the touch electrodes 14 farther from the finger. Based on the difference, the input position can be detected.

As illustrated in FIG. 2, the touch electrodes 14 are constructed from the common electrode 10 h on the array substrate 10 b. The common electrode 10 h includes the touch electrodes 14 that are separated from one another to be arranged in a grid and electrically independent from one another. The touch electrodes 14 that are provided by dividing the common electrode 10 h are arranged in a matrix including lines of the touch electrodes 14 along the X-axis direction and the Y-axis direction in the display area AA. Each touch electrode 14 has a substantially square shape in a plan view with about some millimeters (e.g., two to five millimeters) of edges. Each touch electrode 14 is significantly larger than the pixel PX (or the pixel electrode 10 g) in the plan view. Each touch electrode 14 is disposed in an area that covers multiple (e.g., several tens or hundreds of) pixels PX with respect to the X-axis direction and the Y-axis direction. Multiple touch lines 15 (the position detection lines) on the array substrate 10 b are selectively connected to the touch electrodes 14. The touch lines 15 extend parallel to the source lines 10 j and substantially along the Y-axis direction. The touch lines 15 are connected to specific ones of the touch electrodes 14 that are arranged along the Y-axis direction. The touch lines 15 are connected to a detection circuit that is not illustrated. The detection circuit may be included in the driver 12 or may be provided outside the liquid crystal panel 10 and connected via the flexible circuit board 12. The touch lines 15 supply reference voltage signals related to the image display function and touch signals (position detection signals) related to the touch function to the touch electrodes 14 at different timing. When the reference voltage signals are transmitted to all the touch lines 15 at the same time, all the touch electrodes 14 are at the reference potential and function as the common electrode 10 h. FIG. 2 schematically illustrates the arrangement of the touch electrodes 14. The number, the arrangement, and the two-dimensional shape of the touch electrodes 14 may be altered from those in the drawings where appropriate.

Films stacked on top of one another on the inner surface of the array substrate 10 b will be described. As illustrated in FIG. 4, on the glass substrate 10GS of the array substrate 10 b, a first metal film 16 (a lower metal film, a gate metal film), a gate insulator 17, a semiconductor film 18, a second metal film 19 (a lower metal film, a source metal film), a planarization film 20 (a first insulator, an organic insulator), a third metal film 21 (a metal film), a lower interlayer insulator 22 (a second insulator, a second lower insulator, an inorganic insulator), a first transparent electrode film 23, an upper interlayer insulator 24 (a second insulator, a second upper insulator, an inorganic insulator), and a second transparent electrode film 25 are disposed on top of one another in this sequence from a lower layer side (on a glass substrate 10GS side).

Each of the first metal film 16, the second metal film 19, and the third metal film 21 is a single layer film made of one kind of metal selected from copper, titanium, aluminum, molybdenum, and tungsten. Alternatively, each of the first metal film 16, the second metal film 19, and the third metal film 21 is a laminated film made of different kinds of metals or alloy. The first metal film 16, the second metal film 19, and the third metal film 21 have conductivity and light blocking properties. The gate lines 10 i and the gate electrodes 10 f 1 of the TFTs 10 f are sections of the first metal film 16. The source lines 10 j, the touch lines 15, and the source electrodes 10 f 2 and the drain electrodes 10 f 3 of the TFTs 10 f are sections of the second metal film 19. The touch lines 15 are sections of the third metal film 21. The gate insulator 17, the lower interlayer insulator 22, and the upper interlayer insulator 24 are made of non-organic material such as silicon nitride (SiN_(x)) and silicon oxide (SiO₂). The gate insulator 17 insulates the metal films 19 and 21 and the transparent electrode films 23 and 25 on the upper layer side from the metal films 16, 19 and 21 and the first transparent electrode film 23 on the lower layer side. The insulators 17, 22 and 24 made of the inorganic materials are disposed to straddle the display area AA and the non-display area NAA. The thicknesses of the insulators 17, 22 and 24 made of the inorganic materials are smaller than the thickness of the planarization film 20, which will be described next. It is preferable to set the thicknesses in a range from 0.2 μm to 0.3 μm. However, the thicknesses may be set in a different range. The planarization film 20 is made of an organic material such as an acrylic resin (e.g., PMMA). The planarization film 20 is provided for compensating differences in height created on a lower layer side relative to the planarization film 20. The planarization film 20 has a thickness larger than the thicknesses of the insulators 17, 22 and 24 made of the inorganic materials. It is preferable to set the thickness of the planarization film 20 in a range from 1.5 μm to 3 μm. However, the thickness may be set in a different range. The semiconductor film 18 is a thin film made of an oxide semiconductor. Channels 10 f 4 (semiconductor portions) connected to the source electrodes 10 f 2 and the drain electrodes 10 f 3 are sections of the semiconductor film 18. The oxide semiconductor to form the semiconductor film 18 may be an amorphous oxide semiconductor. Alternately, the oxide semiconductor may be a crystalline oxide semiconductor including a crystalline portion (e.g., a polycrystalline oxide semiconductor, a microcrystalline oxide semiconductor, a crystalline oxide semiconductor with a c-axis substantially perpendicular to a layer surface). The oxide semiconductor may have a single-layer structure or a multilayer structure. The oxide semiconductor to form the semiconductor film 18 may be an indium gallium zinc oxide (In—Ga—Zn—O) based semiconductor. The first transparent electrode film 23 and the second transparent electrode film 25 are made of transparent electrode materials (e.g., indium tin oxide (ITO), indium zinc oxide (IZO)) and disposed to straddle the display area AA and the non-display area NAA. The pixel electrodes 10 g are sections of the first transparent electrode film 23. The common electrode 10 h (the touch electrodes 14) is a section of the second transparent electrode film 25.

The configurations of the TFTs 10 f and the pixel electrodes 10 g will be described in detail. As illustrated in FIGS. 3 and 4, the TFTs f include the gate electrodes 10 f 1 that are branched off from the gate lines 10 i that are prepared from the first metal film 16. The gate electrodes 10 f 1 are portions of the gate lines 10 i crossing the source lines 10 j. The portions project toward the pixel electrodes 10 g to which the gate electrodes 10 f 1 are to be connected along the Y-axis direction. Each of the gate electrodes 10 f 1 has a substantially square shape in the plan view. The TFTs 10 f include the source electrodes 10 f 2 that are portions of the source lines 10 j that is prepared from the second metal film 19 overlapping the gate electrodes 10 f 1. The source electrodes 10 f 2 are the portions of the source lines 10 j extending in substantially straight lines along the Y-axis direction. The TFTs 10 f include the drain electrodes 10 f 3 that are prepared from the second metal film 19 and separated from the source electrodes 10 f 2 with gaps. Each of the drain electrodes 10 f 3 has a substantially L shape in the plan view. First ends of the drain electrodes 10 f 3 are opposed to the source electrodes 10 f 2 and connected to the channels 10 f 4. Second ends of the drain electrodes 10 f 3 are connected to the pixel electrodes 10 g.

As illustrated in FIGS. 3 and 4, the pixel electrodes 10 g prepared from the first transparent electrode film 23 include pixel electrode bodies 10 g 1 and contacts 10 g 2. Each of the pixel electrode bodies 10 g has a substantially parallelogram shape. The contacts 10 g 2 project from the pixel electrode bodies 10 gi toward the TFTs 10 f along the Y-axis direction. The contacts 10 g 2 are connected to the drain electrodes 10 f 3. The contacts 10 g 2 prepared from the first transparent electrode film 23 and the drain electrodes 10 f 3 partially overlap each other. The overlapping sections of the contacts 10 g 2 and the drain electrodes 10 f 3 are connected to each other via pixel contact holes 26 drilled through the planarization film 20 and the lower interlayer insulator 22 disposed therebetween. The TFTs 10 f include the channels 10 f 4 that overlap the gate electrodes 10 f 1 via the gate insulator 17. The channels 10 f 4 are prepared from the semiconductor film 18 and connected to the source electrodes 10 f 2 and the drain electrodes 10 f 3. The channels 10 f 4 extend in the X-axis direction to cross the gate electrodes 10 f 1. The first ends of the channels 10 f 4 are connected to the source electrodes 10 f 2 and the second ends of the channels 10 f 4 are connected to the drain electrodes 10 f 3. When the TFTs 10 f are tuned on based on the scan signals supplied to the gate electrodes 10 f 1 via the gate lines 10 i, potentials related to the image signals supplied to the source lines 10 j are supplied from the source electrodes 10 f 2 to the drain electrodes 10 f 3 via the channels 10 f 4 to charge the pixel electrodes 10 g. The semiconductor film 18 to form the channels 10 f 4 of the TFTs 10 f is made of the oxide semiconductor having electron mobility higher than that of the amorphous silicon thin film. The TFTs 10 f are “oxide semiconductor TFTs (IGZO-TFTs).” The TFTs 10 f has a reduced size and advantages in improvement of definition and aperture ratio. Furthermore, turn-off characteristics of the TFTs 10 f are high and thus a leak current can be reduced. The TFTs 10 f have an advantage in reduction of power consumption. In comparison to the amorphous silicon, the electron mobility of the oxide semiconductor of the semiconductor film 18 is about 20 to 50 times higher than that of the amorphous silicon thin film and the leak current is about one hundredth, which is significantly smaller.

Next, the touch lines 15 will be described in detail. As illustrated in FIGS. 3 and 4, the touch lines 15 prepared from the third metal film 21 are connected to the corresponding touch electrodes 14 prepared from the second transparent electrode film 25 via the touch electrode contact holes 27 in an internal space 10IS and the display area AA (inside the sealant 10 d). The touch electrode contact holes 27 are drilled through the lower interlayer insulator 22 and the upper interlayer insulator 24. The touch lines 15 include wide sections adjacent to the TFTs 10 f (the drain electrodes 10 f 3) in the X-axis direction. The wide sections 15 a function as connecting pads for the touch electrodes 14. The wide sections 15 a are the sections of the touch lines 15 that cross the TFTs 10 f arranged in lines along the Y-axis direction at positions adjacent to the TFTs 10 f. The touch electrode contact holes 27 are arranged to overlap some of (or one of) the wide sections 15 a. Because the wide sections 15 a are provided for the TFTs 10 f (the pixel electrodes 10 g), respectively, parasitic capacitances between the touch lines 15 and the TFTs 10 f or the pixel electrodes 10 g can be equalized. The touch lines 15 extend substantially along the Y-axis direction to cross all the touch electrodes. However, the touch lines 15 are connected to the specific touch electrodes 14 according to the two-dimensional arrangement of the touch electrode contact holes 27. The touch lines 15 are disposed to overlap the source lines 10 j in the plan view.

As illustrated in FIG. 2, the touch lines 15 are routed to spread in a fan shape in the non-display area NAA outside the internal space 10IS (outer than the sealant 10 d). Leading ends of the touch lines 15 are connected to touch leads 28. The touch leads 28 are routed to spread in a fan shape parallel to the touch lines 15. First ends of the touch leads 28 are connected to the touch lines 15 and second ends of the touch leads 28 are connected to the driver 11. As illustrated in FIG. 5, the first ends of the touch lines 28 prepared from the second metal film 19 overlap the leading ends of the touch lines 15 prepared from the third metal film 21. The first ends and the leading ends overlapping each other are connected to each other via contact holes 29 drilled through the planarization film 20 disposed therebetween. The second ends of the touch leads 28 include terminals connected to the driver 11. Similar to the touch lines 15, the source lines 10 j are connected to the driver 11 via source leads that may be prepared from the first metal film 16.

As illustrated in FIGS. 6 and 7, film forming area defining recesses 30 are provided in the non-display area NAA of the array substrate 10 b to define an area in which alignment film 10 n is formed. The film forming area defining recesses 30 include recessed sections of the planarization film 20 disposed in a layer that is lower than the third metal film 21 from which the touch lines 15 are prepared. The film forming area defining recesses 30 are parallel to four edges of the display area AA having a rectangular shape in the plan view. The film forming area defining recesses 30 form a frame shape along outlines of the display area AA and the sealant 10 d as a whole (see FIG. 2). The film forming area defining recesses 30 between the display area AA and the driver 11 among the film forming area defining recesses 30 along the four edges linearly extend in a direction along short sides of the display area AA and the sealant 10 d (the X-axis direction, a direction crossing (or perpendicular) to a direction in which the lines extend). As illustrated in FIGS. 6 to 9, the film forming area defining recesses 30 are formed in sections of the planarization film 20 not overlapping the touch lines 15 in the plan view. In sections of the planarization film 20 overlapping the touch lines in the plan view, the film forming area defining recesses 30 are not formed. Namely, edges of the sections in which the film forming area defining recesses 30 are formed extending in the X-axis direction substantially equal to intervals between the touch lines 15 separated from each other in the X-axis direction. The film forming area defining recesses 30 between the display area AA and the driver 11 will be described in detail. In FIG. 6, the upper side is the display area AA side and the lower side is the driver 11 side. In FIGS. 6, 8 and 9, the source lines 10 j are not illustrated.

As illustrated in FIGS. 6 and 7, the film forming area defining recesses 30 between the display area AA and the driver 11 are arranged such that every three of them are parallel to one another and separated from one another in the Y-axis direction. All three of the film forming area defining recesses 30 arranged in the Y-axis direction overlap the sealant 10 d in the plan view. One of the film forming area defining recesses 30 the farthest from the display area AA, that is, the outermost one of the film forming area defining recesses 30 is located at about the middle of the sealant 10 d in a width direction of the sealant 10 d. The three film forming area defining recesses 30 arranged in the Y-axis direction are all located outer than the outer edge of the sealant 10 d. The film forming area defining recesses 30 include holes that are drilled (open) through the planarization film 20 in a thickness direction of the planarization film 20. The lower interlayer insulator 22 and the upper interlayer insulator 24 disposed in layers that are upper than the planarization film 20 in which the film forming area defining recesses 30 include sections that overlap the film forming area defining recesses 30 and recessed.

During the formation of the alignment film 10 n on the array substrate 10 b, a material of the alignment film 10 n having flowability is supplied to the display area AA on the glass substrate 10GS. The material spreads over the innermost surface (in a layer that is upper than the upper layer interlayer insulator 24 on the glass substrate GS). As a result, the alignment film 10 n is formed in at least an about entire area of the display area AA. Specifically, the material of the alignment film 10 n is applied to the array substrate 10 b using an inkjet device, for example. The application is performed by intermittently injecting liquid drops of the material of the alignment film 10 n from a nozzle of the inkjet device onto the second transparent electrode film 25 in the display area AA. The liquid drops of the material of the alignment film 10 n in the display area AA flow from landing points and spread over surfaces of the upper interlayer insulator 24 and the second transparent electrode film 25 to wet them. At least some of the liquid drops spread from the display area AA to the non-display area NAA. As illustrated in FIG. 7, the material of the alignment film 10 n reaches target positions at which the sealant 10 d is to be formed in the non-display area NAA and flows into the film forming area defining recesses 30 at the target positions (specifically, in the sections of the upper interlayer insulator 24 recessed along the film forming area defining recesses 30). The film forming areas are defined. The film forming area defining recesses 30 are arranged such that every three of them are arranged parallel to and separated from one another. If the material of the alignment film 10 n flows over the film forming area defining recess 30 the closest to the display area AA, the material is less likely to flow over at least the film forming area defining recess 30 the farthest from the display area AA (at the outermost position) of remaining two of them. Therefore, the material of the alignment film 10 n is less likely to spread outer than each film forming area defining recess 30 in the non-display area NAA. Sections of the sealant outer than the outermost film forming area defining recesses 30 (including the outer edges) are less likely to overlap the alignment film 10 n. A reduction in adhesiveness (fixing strength) of the sealant 10 d to the array substrate 10 b is less likely to occur and thus the substrates 10 a and 10 b are less likely to be removed. In FIG. 7, the alignment film 10 n is indicated by long dashed double-dotted lines and the film forming area of the alignment film 10 n is defined by the film forming defining recesses 30 in the middle. Such a configuration may be altered.

As illustrated in FIGS. 7 and 9, the film forming area defining recesses 30 extend in the X-axis direction, that is, a direction perpendicular to (crossing) the extending direction of the touch lines 15. The film forming area defining recesses 30 are the recessed sections of the planarization film 20, which has the thickness larger than the thicknesses of the lower interlayer insulator 22 and the upper interlayer insulator 24. This configuration is preferable for achieving a large depth. According to the configuration, a larger amount of the material of the alignment film is held in each of the film forming area defining recesses 30. Performance in definition of the film forming area to form the alignment film 10 n improves. The planarization film 20 in which the film forming area defining recesses 30 are formed is disposed in the layer that is lower than the third metal film 21 from which the touch lines 15 are prepared. However, the film forming area defining recesses 30 do not overlap the touch lines 15 as illustrated in FIGS. 6 and 8. Therefore, the film forming area defining recesses 30 are less likely to affect the flatness of the touch lines 15. According to the configuration, the touch lines 15 are less likely to have irregularities in thickness resulting from the film forming area defining recesses 30. Therefore, the touch lines 15 are less likely to have breaks. Furthermore, as illustrated in FIGS. 7 and 9, the film forming area defining recesses 30 are drilled through the planarization film 20, that is, the largest depth can be achieved. A larger amount of the material of the alignment film 10 n can be held in the film forming area defining recesses 30 and thus the performance in definition of the film forming area to form the alignment film 10 n further improves.

As illustrated in FIGS. 2 and 5, the touch lines 15 prepared from the third metal film 21, are connected to the touch leads 28 prepared from the second metal film 19 via contact holes drilled through the planarization film 20 at positions outside the sealant 10 d (on an opposite side from the internal space 10IS side), as described earlier. The second metal film 19 is disposed in the layer that is lower than the third metal film 21. In comparison to a configuration in which the contact holes are located on the internal space 10IS side relative to the sealant 10 d, this configuration is preferable for increasing the definition and reducing the frame width because the second metal film 19 can be used for different lines (e.g., the source lines 10 j) in the internal space 10IS. In this embodiment, the third metal film 21 disposed in the layer that is upper than the planarization film 20 includes the sections configured as the touch lines 15. The planarization film 20 disposed in the layer that is lower than the third metal film 21 includes the film forming area defining recesses 30 not to overlap the touch lines 15. According to the configuration, the reduction in flatness of the touch lines 15 resulting from the film forming area defining recesses 30 is less likely to occur but the definition of the forming area of the alignment film 10 n can be properly performed.

As described above, the array substrate 10 b (a display substrate) in this embodiment includes the glass substrate 10GS (the substrate), the planarization film 20 (the first insulator), the third metal film 21 (the metal film), the lower interlayer insulator 22, the upper interlayer insulator 24, the alignment film 10 n, the touch lines 15 (the lines), and the film forming area defining recesses 30. The glass substrate 10GS includes the display area AA in which images can be displayed and the non-display area NAA on the outer edge side to surround the display area AA. The planarization film 20 is disposed to straddle the display area AA and the non-display are NAA of the glass substrate 10GS. The third metal film 21 is disposed in the layer that is upper than the planarization film 20 to straddle the display area AA and the non-display area NAA. The lower interlayer insulator 22 and the upper interlayer insulator 24 that are included in the second insulator have the thicknesses smaller than the thickness of the planarization film 20. The alignment film 10 n disposed in the layer that is upper than the lower interlayer insulator 22 and the upper interlayer insulator 24 that are included in the second insulator is disposed at least in the display area AA. The touch lines 15 include sections of the third metal film 21 and extend to straddle the display area AA and the non-display area NAA. The film forming area defining recesses 30 are provided in the non-display area NAA to extend in the direction crossing the extending direction of the touch lines 15. The film forming area defining recesses 30 include the recessed sections of the planarization film 20 and provided not to overlap the touch lines 15 to define the forming area of the alignment film 10 n.

In the formation of the alignment film 10 n, the material of the alignment film 10 n having the flowability is supplied to the display area AA of the glass substrate 10GS. The material flows to spread in the layer that is upper than the lower interlayer insulator 22 and the upper interlayer insulator 24 that are included in the second insulator that is disposed on the glass substrate 10GS. As a result, the alignment film 10 n is formed at least in the display area AA. The material of the alignment film 10 n supplied to the display area AA may reach the non-display area NAA. By defining the forming area of the alignment film 10 n is defined with the film forming area defining recesses 30 in the non-display area NAA. Therefore, the material of the alignment film 10 n is less likely to spread outer than the film forming area defining recesses 30 in the non-display area NAA.

The film forming area defining recesses 30 extend in the direction crossing the extending direction of the touch lines 15. The film forming area defining recesses 30 include the recessed sections of the planarization film 20 having the thickness larger than the thicknesses of the lower interlayer insulator 22 and the upper interlayer insulator 24 that are included in the second insulator. The configuration is preferable for achieving a larger depth. According to the configuration, a larger amount of the material of the alignment film can be held in each of the film forming area defining recesses 30 and thus the performance in definition of the film forming area to form the alignment film 10 n improves. The planarization film 20 including the film forming area defining recesses 30 is disposed in the layer that is lower than the third metal film 21. However, the film forming area defining recesses 30 are arranged not to overlap the touch lines 15. Therefore, the film forming area defining recesses 30 are less likely to affect the flatness of the touch lines 15. According to the configuration, the touch lines 15 are less likely to have irregularities in thickness and thus less likely to have breaks.

The film forming area defining recesses 30 are drilled through the planarization film 20. According to the configuration, the largest depth can be achieved. A larger amount of the material of the alignment film 10 n can be held in the film forming area defining recesses 30 and thus the performance in definition of the film forming area to form the alignment film 10 n further improves.

The second insulator includes the lower interlayer insulator 22 (the lower-side second insulator) on the lower-layer side and the upper interlayer insulator 24 (the upper-side second insulator) on the upper-layer side. The first transparent electrode film 23 is disposed between the lower interlayer insulator 22 and the upper interlayer insulator 24. The second transparent electrode film 25 is disposed in the layer that is upper than the upper interlayer insulator 24. The touch electrodes 14 (the position detection electrodes) include sections of the first transparent electrode film 23 or the second transparent electrode film 25. The touch electrodes 14 and the finger, which is the position input member for the position input, form capacitors therebetween to detect the positions of input by the finger that is the position input member. The lines are the touch lines 15 (the position detection lines) connected to the touch electrodes 14. The touch electrodes 14 and the finger, which is the position input member for the position input, form the capacitors therebetween and the positions of input by the finger that is the position input member can be detected using the signals supplied through the touch lines 15. The touch lines 15 that are lines are less likely to have the breaks resulting from the film forming area defining recesses 30 and thus the position input function is properly performed.

The liquid crystal panel 10 (the display device) according to this embodiment includes the array substrate 10 b described above and the CF substrate 10 a (the opposed substrate) opposed to the array substrate 10 b with the internal space 10IS therebetween. According to the liquid crystal panel 10 having such a configuration, the touch lines 15 are less likely to have the breaks resulting from the film forming area defining recesses 30. Therefore, a malfunction is less likely to occur.

The sealant 10 d is disposed between the array substrate 10 b and the CF substrate 10 a in the non-display area NAA to surround and seal the internal space 10IS. The film forming area defining recesses 30 are arranged to overlap the sealant 10 d and closer to the internal space 10IS relative to the outer edges of the sealant 10 d. By defining the forming area of the alignment film 10 n with the film forming area defining recesses, the alignment film 10 n is less likely to reach at least the outer edges of the sealant 10 d. According to the configuration, the fixing strength of the sealant 10 d to the glass substrate 10GS is maintained at a sufficient level and thus the substrates 10 a and 10 b are less likely to be removed.

The second metal film 19 (the lower metal film) disposed in the layer that is lower than the planarization film 20. The touch leads 28 (the leads) include sections of the second metal film 19 and are disposed on the opposite side from the internal space 10IS relative to the sealant 10 d in the non-display area NAA. The touch leads 28 partially overlap the touch lines 15. The contact holes 29 are drilled through the sections of the planarization film 20 overlapping the touch lines 15 and the touch leads 28. The touch lines 15 are connected to the touch leads 28 that include the sections of the second metal film 19 via the contact holes 29 drilled through the planarization film 20. In comparison to a configuration in which the contact holes are arranged on the internal space 10IS side relative to the sealant 10 d, this configuration is preferable for increasing the definition and reducing the frame width because the second metal film 19 can be used for the different lines in the internal space 10IS. The third metal film 21 disposed in the layer that is upper than the planarization film 20 includes the sections configured as the touch lines 15. However, the film forming area defining recesses 30 are formed in the planarization film 20 not to overlap the touch lines 15. Therefore, the forming area of the alignment film 10 n is properly defined without a reduction in flatness of the touch lines 15 resulting from the film forming area defining recesses 30.

Second Embodiment

A second embodiment of the present invention will be described with reference to FIGS. 10 to 13. The second embodiment includes forming areas in which film forming area defining recesses 130 are formed are different from those of the first embodiment. Furthermore, the second embodiment includes second film forming area defining recesses 32. Configuration, functions, and effects similar to those of the first embodiment will not be described.

As illustrated in FIGS. 10 and 12, a planarization film 120 include line adjacent sections 31 that sandwich touch lines 115 at least in the X-axis direction and do not overlap the touch lines 115. The film forming area defining recesses 130 in this embodiment are not formed in the line adjacent sections 31. The line adjacent sections 31 of the planarization film 120 in which the film forming area defining recesses 130 are not formed are provided adjacent to the touch lines 115 in the X-axis direction. The line adjacent sections 31 have a width smaller than the width of the touch lines 115. As illustrated in FIGS. 11 and 13, a lower interlayer insulator 122 and an upper interlayer insulator 124 disposed in layers upper than the planarization film 120 include second film forming area defining recesses 32 to overlap the touch lines 115 and the line adjacent sections 31. The second film forming area defining recesses 32 are aligned with the film forming area defining recesses 130 with respect to the Y-axis direction but not with respect to the X-axis direction. The second film forming area defining recesses 32 do not overlap the film forming area defining recesses 130 in the plan view.

In this configuration, as illustrated in FIGS. 10 and 12, the film forming area defining recesses 130 are not formed in the sections of the planarization film 120 overlapping the touch lines 115 and the line adjacent sections 31 sandwiching at least the touch lines 115. Even if the planarization film 120 having the thickness larger than the thicknesses of the lower interlayer insulator 122 and the upper interlayer insulator 124 is processed with lower accuracy in comparison to the lower interlayer insulator 122 and the upper interlayer insulator 124, the film forming area defining recesses 130 are less likely to be accidentally formed to overlap the touch lines 115. Specifically, the thickness of the planarization film 120 is about ten times larger than the thicknesses of the lower interlayer insulator 122 and the upper interlayer insulator 124. Displacement of positions of the forming areas of the film forming area defining recesses 130 formed by patterning the planarization film 120 through photolithography from target positions tends to occur. Because of the width of the line adjacent sections 31, margins are provided. The displacement can be compensated and thus overlapping of the film forming area defining recesses 130 with the touch lines 115 is less likely to occur. In the configuration in which the film forming area defining recesses 130 are not formed in the line adjacent sections 31, the performance in definition of the film forming areas in which the alignment film 110 n is formed may decrease. As illustrated in FIGS. 11 and 13, the lower interlayer insulator 122 and the upper interlayer insulator 124 include the second film forming area defining recesses 32 to overlap the touch lines 115 and the line adjacent sections 31 in which the film forming area defining recesses 130 are not formed. In the areas in which the film forming area defining recesses 130 are not formed, the forming areas in which the alignment film 110 n is formed are defined by the second film forming area defining recesses 32. Therefore, the performance in in definition of the film forming areas in which the alignment film 110 n is formed is less likely to decrease.

As illustrated in FIGS. 11 and 12, the second film forming area defining recesses 32 include second lower film forming area defining recesses 32 a and second upper film forming area defining recesses 32 b. The second lower film forming area defining recesses 32 a are prepared by recessing sections of the lower interlayer insulator 122 in the Y-axis direction. The second upper film forming area defining recesses 32 b are prepared by recessing sections of the upper interlayer insulator 124 in the Y-axis direction. The second lower film forming area defining recesses 32 a and the second upper film forming area defining recesses 32 b are communicated with each other. In comparison to a configuration in which the second film forming area defining recesses include either the second upper film forming area defining recesses or the second lower film forming area defining recesses, the second film forming area defining recesses 32 have a larger depth. Therefore, the performance in in definition of the film forming areas in which the alignment film 110 n is formed further improves. Furthermore, first line protectors 33 prepared from a first transparent electrode film 123 are connected to the touch lines 115 via the second lower film forming area defining recesses 32 a that are drilled through the lower interlayer insulator 122. The first line protectors 33 are disposed to overlap sections of the touch lines 115 crossing three second film forming area defining recesses 32 for about an entire width thereof in a plan view. The first line protectors 33 are connected to the touch lines 115 for every three second lower film forming area defining recesses 32 a. Second line protectors 34 are connected to the first line protectors 33 prepared from a second transparent electrode film 125 via the second upper film forming area defining recesses 32 b that are drilled through the upper interlayer insulator 124. The second line protectors 34 are disposed to overlap the first line protectors 33 (sections of the touch lines 115 crossing three second film forming area defining recesses 32) for about an entire width thereof in a plan view. The second line protectors 34 are connected to the first line protectors 33 for every three second upper film forming area defining recesses 32 b. The first line protectors 33 and the second line protectors 34 connected to the touch lines 115 via the second lower film forming area defining recesses 32 a and the second upper film forming area defining recesses 32 b are provided for protection of the touch lines 115 and reduction in resistance of the touchlines 115.

In the this embodiment, the film forming area defining recesses 130 are not formed in the line adjacent sections 31 of the planarization film 120 sandwiching the touch lines 115. The lower interlayer insulator 122 and the upper interlayer insulator 124 that are included in the second insulator include the second film forming area defining recesses 32 to overlap the touch lines 115 and the line adjacent sections 31. The film forming area defining recesses 130 are not formed in the sections of the planarization film 120 not overlapping the touch lines 115 and in the line adjacent sections 31 sandwiching at least the touch lines 115. Even if the planarization film 120 having the thickness larger than the thicknesses of the lower interlayer insulator 122 and the upper interlayer insulator 124 is processed with lower accuracy in comparison to the lower interlayer insulator 122 and the upper interlayer insulator 124, the film forming area defining recesses 130 are less likely to be accidentally formed to overlap the touch lines 115. In the configuration in which the film forming area defining recesses 130 are not formed in the line adjacent sections 31, the performance in definition of the film forming areas in which the alignment film 110 n is formed may decrease. The lower interlayer insulator 122 and the upper interlayer insulator 124 that are included in the second insulator include the second film forming area defining recesses 32 to overlap the touch lines 115 and the line adjacent sections 31 in which the film forming area defining recesses 130 are not formed. In the areas in which the film forming area defining recesses 130 are not formed, the film forming areas in which the alignment film 110 n is formed are defined by the second film forming area defining recesses 32. Therefore, the performance in in definition of the film forming areas in which the alignment film 110 n is formed is less likely to decrease.

Other Embodiment

The technology described herein is not limited to the embodiments described above and illustrated by the drawings. For example, the following embodiments will be included in the technical scope of the present invention.

(1) In each of the above embodiments, the touch lines connected to the touch electrodes are provided as an example of the “lines.” The film forming area defining recesses cross the lines. However, the film forming area defining recesses may be formed to cross other lines. For example, in a liquid crystal panel that does not use a common electrode for a touch panel pattern, the common electrode may not include divided sections, a line for supplying image display reference potential to the common electrode may be prepared from the third metal film, and the film forming area defining recesses may be formed to cross the line. In this case, the liquid crystal panel may not have the touch panel function.

(2) In each of the above embodiments, the film forming area defining recesses disposed between the display are and the driver have the shape that linearly extends. However, the film forming area recesses may have a wavy shape or a zigzag shape in a plan view.

(3) In each of the above embodiments, the touch leads are prepared from the second metal film. However, the touch leads may be prepared from the first metal film.

(4) In each of the above embodiments, the pixel electrodes are prepared from the first transparent electrode film and the common electrode is prepared from the second transparent electrode film. However, the pixel electrodes and the common electrode may be disposed opposite way around such that the pixel electrodes may be prepared from the second transparent electrode film and the common electrode may be prepared from the first transparent electrode film.

(5) In each of the above embodiments, the film forming area defining recesses are drilled through the planarization film. However, the film forming area defining recesses may be formed in the planarization film but may not be through holes.

(6) In the second embodiment, the second lower film forming area defining recesses and the second upper film forming area defining recesses included in the second film forming area defining recesses have the same width. However, the width of the second lower film forming area defining recesses and the width of the second upper film forming area defining recesses may be different from each other.

(7) In the second embodiment, the first line protectors and the second line protectors are provided in the configuration in which the second film forming area defining recesses are formed in the lower interlayer insulator and the upper interlayer insulator. However, the first line protectors and/or the second line protectors may be omitted.

(8) In the second embodiment, the second film forming area defining recesses are formed in the lower interlayer insulator and the upper interlayer insulator. However, the second film forming area defining recesses may be formed only one of the lower interlayer insulator and the upper interlayer insulator.

(9) In the second embodiment, the second film forming area defining recesses are drilled through the lower interlayer insulator and the upper interlayer insulator. However, the second film forming area defining recesses may be formed in one or both of the lower interlayer insulator and the upper interlayer insulator without openings on one side.

(10) In each of the above embodiments, the number of the film forming area defining recesses in the Y-axis direction is three. However, the number may be one, two, or four or greater.

(11) In each of the above embodiments, the planarization film is the single layer film made of the organic material. However, the planarization film may be a multilayer film including a layer made of an organic material and a layer made of an inorganic material.

(12) In each of the above embodiments, the alignment film is applied by the inkjet device. However, the alignment film may be applied using a printing device. The material of the alignment film used in either case has high flowability. Therefore, the forming areas need to be defined.

(13) In each of the above embodiments, two pixel overlapping openings 10 h 1 are provided in the common electrode. However, one pixel overlapping opening or three or more pixel overlapping openings may be provided. The outline of each pixel overlapping opening in the plan view may be altered from one that is illustrated in the drawing. The pixel overlapping openings may be provided in the pixel electrodes rather than the common electrode.

(14) The configuration of the pixels in the display area and the connecting structure of the touch lines to the touch electrodes may be altered from those in each of the above embodiment where appropriate.

(15) In each of the above embodiments, the CF substrate includes the light blocking portion. However, the array substrate may include the light blocking portion.

(16) The material of the semiconductor film from which the channels of the TFTs are prepared may be amorphous silicon or polysilicon rather than the material in each of the above embodiments. If the polysilicon is used for the material of the semiconductor film, it is preferable to use bottom gate type TFTs.

(17) In each of the above embodiments, the touch panel pattern uses the self-capacitance method. However, the touch panel pattern may use a mutual capacitance method.

(18) In each of the above embodiments, the transmissive liquid crystal panel is used. However, a reflective liquid crystal panel or a semitransmissive liquid crystal panel may be in the technical scope of the present invention.

(19) In each of the above embodiments, the shape of the liquid crystal display device (the liquid crystal panel or the backlight unit) in the plan view is vertically-long rectangular. However, the shape of the liquid crystal display device in the plan view may be horizontally-long rectangular, square, circular, semicircular, oval, elliptic, or trapezoidal.

(20) In each of the above embodiments, the liquid crystal panel has the configuration in which the liquid crystal layer is sandwiched between the substrates. However, a display panel including functional organic molecules other than the liquid crystal material sandwiched between substrates may be included in the technical scope of the present invention.

EXPLANATION OF SYMBOLS

10: Liquid crystal panel (Display device), 10 a: CF substrate (Opposed substrate), 10 b: Array substrate (Display substrate), 10 d: Sealant, 10 n, 110 n: Alignment film, 10GS: Glass substrate (Substrate), 10IS: Internal space, 14: Touch electrode (Position detection electrode), 15, 115: Touch line (Lines, Position detection line), 16: First metal film (Lower metal film), 19: Second metal film (Lower metal film), 20, 120: Planarization film (First insulator), 21: Third metal film (Metal film), 22, 122: Lower interlayer insulator (Second insulator, Lower second insulator), 23, 123: First transparent electrode film, 24, 124: Upper interlayer insulator (Second insulator, Upper second insulator), 25, 125: Second transparent electrode film, 28: Touch lead (Lead), 29: Contact hole, 30, 130: Film forming area defining recess, 31: Line adjacent section, 32: Second film forming area defining recess, AA: Display area, NAA: Non-display area 

1. A display substrate comprising: a substrate including a display area in which an image is displayed and a non-display area on an outer edge side to surround the display area; a first insulator disposed to straddle the display area and the non-display area of the substrate; a metal film disposed in a layer upper than the first insulator to straddle the display area and the non-display area of the substrate; a second insulator disposed in a layer upper than the metal film to straddle the display area and the non-display area of the substrate, the second insulator having a thickness smaller than a thickness of the first insulator; an alignment film disposed in a layer upper than the second insulator at least in the display area; a line extending to straddle the display area and the non-display area, the line including a section of the metal film, and film forming area defining recesses provided in the non-display area to extend in a direction crossing an extending direction in which the line extends but not to overlap the line, the film forming area defining recesses including recessed sections of the first insulator to define a forming area of the alignment film.
 2. The display substrate according to claim 1, wherein the film forming area defining recesses are drilled through the first insulator.
 3. The display substrate according to claim 1, wherein the film forming area defining recesses are not formed in two line adjacent sections of the first insulator sandwiching the line, and the second insulator includes second film forming area defining recesses to overlap the line and the line adjacent sections.
 4. The display substrate according to claim 1, wherein the second insulator includes a lower second insulator disposed in a lower layer and an upper second insulator disposed in an upper layer, the display substrate further comprises: a first transparent electrode film disposed between the lower second insulator and the upper second insulator, a second transparent electrode film disposed in a layer upper than the upper second insulator; and position detection electrodes including sections of the first transparent electrode film or the second transparent electrode film, the position detection electrodes form a capacitor with a position input member by which a position input is performed to detect a position of input by the position input member, wherein the line includes a position detection line connected to the position detection electrodes.
 5. A display device comprising: the display substrate according to claim 1; and an opposed substrate opposed to the display substrate with an internal space between the display substrate and the opposed substrate.
 6. The display device according to claim 5, further comprising a sealant disposed between the display substrate and the opposed substrate in the non-display area to surround and seal the internal space, wherein the film forming area defining recesses are located at positions overlapping the sealant and closer to the internal space relative to an outer edge of the sealant.
 7. The display device according to claim 6, further comprising: a lower metal film disposed in a layer lower than the first insulator; and a lead disposed on an opposite side from the internal space relative to the sealant in the non-display area, the lead including a section of the lower metal film and including a section overlapping the line, wherein the first insulator includes contact holes in sections overlapping the line and the lead. 